The high-frequency wire-bondable device is suited to GaN and GaAs amplifier applications where small size and microwave performance are critical.
“The small footprint, along with X7R temperature stability and wire bondability of the 100nF are integral to a well-performing circuit,” said said Knowles product manager Ian Tovar.
Attachment can be through conductive epoxy or gold-tin (AuSn) solder.
Applications are expected dc blocking and RF supply line bypassing, as well as filtering, tuning and coupling.
The company’s single layer capacitors support microwave and mmWave applications up to 100GHz.